This year's US-Taiwan High-Tech Forum (UTHF) aims to promote the innovation in medical devices and has a theme on "Intellectual Property and Government Regulation in Medical Devices Development". The objective of this conference is to promote the importance of overcoming legal and regulatory bottlenecks in the development of medical devices.

    This conference provides an overview of medical device Intellectual Property (IP) and government regulations as well as discussion in the most recent legal and regulatory issues. Topics covered include an overview of IP protection, freedom to operate, registration requirements, new medical device regulations, and strategies for how to expedite the registration process. Topics also include an overview of cardiovascular devices clinical development programs.

    We would like to thank National Science Council of Taiwan to sponsor this event, the NATEA Board members, the program and working committee members for their countless hours of efforts to make this event possible. We would also like to thank all the speakers, panelists, and attendees for your support.

    The objective of UTHF is to promote the collaboration and interaction between technology and business communities of Silicon Valley and Taiwan.

Please click here for additional information.

More speakers will be released over the next few weeks.

Engineers, entrepreneurs, marketing professionals, and venture capitalists, who are interested in wireless, will benefit from this comprehensive program of technology and business trends in the wireless world.

This is a great opportunity for you to share your comments and suggestions on the issues not covered in this program with others. Please send your comments to:

      Ms. Hsing-Yi Jan, Conference Co-chair,
      Dr. Joseph Yang, Conference Co-chair,
      Dr. San-Laung Chow, Panelist

By 11/06
After 11/07 or On-site
*Seats are limited, please register ASAP.
*Conference price includes lunch.
*Parking is free.
*Please click REGISTRATION button below to register conference online by 11/06/08.

* Pay online with check by 11/7 to
    P. O. Box 360776,
    Milpitas, CA 95036
or PayPal by 11/7.

*To pay on-site, please bring cash or check, payable to NATEA-SV
NATEA Member






Presented By:
      North America Taiwanese Engineers’ Association (NATEA), Silicon Valley Chapter


Sponsored By:
      National Science Council, Taiwan, R.O.C.



Copyright 2008 UTHF., All rights reserved